... NOTES Bottleneck: Incomplete or inconsistent notes on the fabrication drawing. Open Road: Fabrication drawings should include the board specification callout (or IPC-A-600); copper weight | CIRCUIT BOARDS | callout (1/2 oz., 1 oz., 2 oz., etc.); finish requirement (HASL, OSP, immersion gold, etc.); hole size tolerance; specify plated vs. non-plated holes; silkscreen color; | CIRCUIT BOARDS | board thickness and thickness tolerance; route tolerance; scoring specification; quality requirements such as cross section, ionic readings, certificate of compliance, impedance readings with coupons, solder | CIRCUIT BOARDS | sample, electrical test certificate, etc.; pack and ship instructions; and an impedance requirement that does not reflect line width or dielectric callout. NON-FUNCTIONAL LANDS Bottleneck: | CIRCUIT BOARDS | Non-functional lands for the CAM engineer and the manufacturing process engineer are a menace. Not only must the CAM engineer engage in a secondary DfM | CIRCUIT BOARDS | to remove them, but this same process may also lead to the removal of lands that are ...
[ Circuit Boards ]


... after 6 p.m., the first working day is t he day after next. 1.2 Technical preconditions: Productions data and orders which are faulty, incomplete, | CIRCUIT BOARDS | or vary from the details on which the offer is based lead to delays in delivery and/or incorrect execution of the order, etc. | 2. | CIRCUIT BOARDS | LIABILITY DISCLAIMER | 2.1 We do not accept responsibility for any errors incurred when referring to offers or when enquiring. | 3. CORRECT SIDE | | CIRCUIT BOARDS | PRINTED CIRCUIT BOARDS | 3.1 In order to be able to recognise the correct side (mirrored or unmirrored image) legible type must be visible in | CIRCUIT BOARDS | an external position on the conductive pattern. 3.2 The order of layer construction must be given for multilayers. We are not liable for correct execution | CIRCUIT BOARDS | if we are not provided with this information. | 4. CONFUSION | We cannot accept liability for any incorrect execution of PCBs if a file | CIRCUIT BOARDS | description is not provided. | 5. CONVERSION | PRINTED CIRCUIT BOARDS | 5.1 We are not liable for errors occurring as a result of ...
[ Circuit Boards ]


... to unsafe transportation and long storage times. Therefore we would like to give you following proposals to avoid the described problems: A.2 1 ) | CIRCUIT BOARDS | | STORAGE CONDITIONS PCB`S | should be stored in heated and dry rooms. Constant low humidity is necessary before the soldering processes start. A rapid | CIRCUIT BOARDS | fall in temperature of more than 7 degrees causes condensation on the stored PCB`s. Humidity should never exceed 65 %. The package must be kept | CIRCUIT BOARDS | intact although the polyethylene packages capability of keeping humidity away is not really reliable. A.3 2 ) Storage time | THE STORAGE TIME OF PCB`S | CIRCUIT BOARDS | | should be as short as possible. PCB`s should be taken out due to the „first-in, first out“ rule. The the polyethylene packages should be | CIRCUIT BOARDS | taken away just before the assembling. Remaining PCB`s should be repacked again. To avoid exposure to draught, the packages should be stored in boxes. A.4 | CIRCUIT BOARDS | 3 ) | SOLDERING TESTS PCB`S | stored for over several months and being transported under questionable ...
[ Circuit Boards ]